AMD EPYC 7313P processor 3 GHz 128 MB L3

SKU
100-000000339
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In Stock:6 available
16 cores, 32 threads, 3.0 GHz base frequency, 3.7 GHz boost frequency, 128MB L3 cache, 155W TDP
Category: Processors
More Information
Processor socket Socket SP3
Processor cores 16
Processor family AMD EPYC
SKU 100-000000339
EAN 8592978317959
Manufacturer AMD
Availability In Stock
Product Family EPYC
Reviews
Description

AMD EPYC 7313P – Optimized Power for Modern Servers
Deliver high-efficiency processing with the AMD EPYC 7313P, designed to strike the perfect balance between performance, scalability, and reliability in enterprise-grade server deployments.

Octa-Channel Memory for Maximum Bandwidth
With eight DDR4 memory channels supporting up to 3200 MHz, the EPYC 7313P provides massive bandwidth to meet the demands of virtualization, high-performance computing, and intensive data processing.

Socket SP3 Compatibility for Infrastructure Stability
Engineered for full compatibility with AMD's robust SP3 ecosystem, this processor easily integrates with proven server platforms—delivering consistency, efficiency, and thermal reliability.

Built for the Server Market Segment
Optimized specifically for modern data center workloads, the EPYC 7313P is your go-to choice for cloud-native applications, virtualization, and enterprise IT environments.

Trusted AMD Architecture for Mission-Critical Uptime
Backed by AMD’s legacy of server innovation, the EPYC 7313P delivers secure, stable, and predictable compute performance—so your infrastructure keeps running, even when the workloads surge.

Specifications
Processor
Processor base frequency3 GHz
Processor manufacturerAMD
Configurable TDP-down155 W
Thermal Design Power (TDP)155 W
Processor cache128 MB
Processor model7313P
Processor threads32
Processor boost frequency3.7 GHz
Component forServer/workstation
Processor familyAMD EPYC
Processor cores16
Processor socketSocket SP3
Configurable TDP-up180 W
Processor cache typeL3
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
Memory bandwidth (max)204.8 GB/s
Power
Configurable TDP-down155 W
Thermal Design Power (TDP)155 W
Technical details
PCI Express slots version4.0
Thermal Design Power (TDP)155 W
Market segmentServer
Configurable TDP-up180 W
Processor cache typeL3
Features
Maximum number of PCI Express lanes128
Thermal Design Power (TDP)155 W
PCI Express slots version4.0
Market segmentServer
Harmonized System (HS) code85423119
Processor special features
Configurable TDP-up180 W
Logistics data
Harmonized System (HS) code85423119

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SKU
100-000000339
4XG7A37935
100-000000080
100-000000054
100-000000141
100-100000063WOF
Manufacturer
AMD
Lenovo
AMD
AMD
AMD
AMD
Specification
Processor
Processor base frequency3 GHz
Processor manufacturerAMD
Configurable TDP-down155 W
Thermal Design Power (TDP)155 W
Processor cache128 MB
Processor model7313P
Processor threads32
Processor boost frequency3.7 GHz
Component forServer/workstation
Processor familyAMD EPYC
Processor cores16
Processor socketSocket SP3
Configurable TDP-up180 W
Processor cache typeL3
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
Memory bandwidth (max)204.8 GB/s
Power
Configurable TDP-down155 W
Thermal Design Power (TDP)155 W
Technical details
PCI Express slots version4.0
Thermal Design Power (TDP)155 W
Market segmentServer
Configurable TDP-up180 W
Processor cache typeL3
Features
Maximum number of PCI Express lanes128
Thermal Design Power (TDP)155 W
PCI Express slots version4.0
Market segmentServer
Harmonized System (HS) code85423119
Processor special features
Configurable TDP-up180 W
Logistics data
Harmonized System (HS) code85423119
Processor
Processor generation2nd Generation Intel® Xeon® Scalable
Processor base frequency2.1 GHz
Processor codenameCascade Lake
Thermal Design Power (TDP)85 W
Processor cache11 MB
Processor model4208
Processor threads16
Processor operating modes64-bit
Processor boost frequency3.2 GHz
Bus typeUPI
Component forServer/workstation
Processor lithography14 nm
Processor familyIntel Xeon Silver
Processor cores8
Processor socketLGA 3647 (Socket P)
Processor seriesIntel Xeon Silver 4000 Series
Processor cache typeSmart Cache
Memory
Maximum internal memory supported by processor1 TB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2400 MHz
Memory channelsHexa-channel
ECCYes
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)85 W
Technical details
Intel TSX-NIYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Execute Disable BitYes
Enhanced Intel SpeedStep TechnologyYes
PCI Express slots version3.0
Supported instruction setsAVX-512
Scalability2S
Intel VT-x with Extended Page Tables (EPT)Yes
Embedded options availableNo
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Thermal Design Power (TDP)85 W
Processor seriesIntel Xeon Silver 4000 Series
Market segmentServer
Intel Virtualization Technology (VT-x)Yes
Processor cache typeSmart Cache
Features
Maximum number of PCI Express lanes48
Thermal Design Power (TDP)85 W
Processor package size76 x 56.5 mm
Execute Disable BitYes
PCI Express slots version3.0
Supported instruction setsAVX-512
Scalability2S
Embedded options availableNo
Market segmentServer
Harmonized System (HS) code85423119
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Intel Turbo Boost Max Technology 3.0No
Intel® Speed Shift TechnologyYes
Intel TSX-NIYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Enhanced Intel SpeedStep TechnologyYes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Virtualization Technology (VT-x)Yes
Intel® vPro™ Platform EligibilityYes
Operational conditions
Tcase78 °C
Logistics data
Harmonized System (HS) code85423119
Weight & dimensions
Processor package size76 x 56.5 mm
Other features
CompatibilityThinkSystem SR550, ThinkSystem SR590, ThinkSystem SR650
Processor
Processor base frequency3.1 GHz
Processor manufacturerAMD
Cooler includedNo
Thermal Design Power (TDP)120 W
Processor cache64 MB
Processor model7252
Processor threads16
Processor operating modes32-bit
Processor boost frequency3.2 GHz
Component forServer/workstation
Processor lithography7 nm
Processor familyAMD EPYC
Processor cores8
Processor socketSocket SP3
Processor cache typeL3
Package typeTray
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
Memory bandwidth (max)85.3 GB/s
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)120 W
Technical details
PCI Express slots version4.0
Thermal Design Power (TDP)120 W
Market segmentServer
Processor cache typeL3
Features
Maximum number of PCI Express lanes128
Thermal Design Power (TDP)120 W
PCI Express slots version4.0
Market segmentServer
Harmonized System (HS) code85423119
Packaging data
Package typeTray
Logistics data
Harmonized System (HS) code85423119
Processor
Processor base frequency2.5 GHz
Processor manufacturerAMD
Cooler includedNo
Thermal Design Power (TDP)180 W
Processor cache128 MB
Processor model7502
Processor threads64
Processor operating modes32-bit
Processor boost frequency3.35 GHz
Component forServer/workstation
Processor lithography7 nm
Processor familyAMD EPYC
Processor cores32
Processor socketSocket SP3
Processor cache typeL3
Package typeTray
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
Memory bandwidth (max)204.8 GB/s
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)180 W
Technical details
PCI Express slots version4.0
Thermal Design Power (TDP)180 W
Market segmentServer
Processor cache typeL3
Features
Maximum number of PCI Express lanes128
Thermal Design Power (TDP)180 W
PCI Express slots version4.0
Market segmentServer
Harmonized System (HS) code85423119
Packaging data
Package typeTray
Logistics data
Harmonized System (HS) code85423119
Processor
Processor base frequency3.2 GHz
Processor manufacturerAMD
Cooler includedNo
Thermal Design Power (TDP)240 W
Processor cache192 MB
Processor model7F72
Processor threads48
Processor operating modes64-bit
Processor boost frequency3.7 GHz
Component forServer/workstation
Processor familyAMD EPYC
Processor cores24
Processor socketSocket SP3
Processor cache typeL3
Package typeTray
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
Memory bandwidth (max)204.8 GB/s
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)240 W
Technical details
PCI Express slots version4.0
Thermal Design Power (TDP)240 W
Market segmentServer
Processor cache typeL3
Features
Maximum number of PCI Express lanes128
Thermal Design Power (TDP)240 W
PCI Express slots version4.0
Market segmentServer
Harmonized System (HS) code85423119
Packaging data
Package typeTray
Logistics data
Harmonized System (HS) code85423119
Processor
Processor generationAMD Ryzen 5000 Series
Processor base frequency3.8 GHz
Processor manufacturerAMD
Cooler includedNo
Thermal Design Power (TDP)105 W
Processor cache32 MB
Processor model5800X
Processor threads16
Processor operating modes64-bit
Processor boost frequency4.7 GHz
Component forPC
Processor lithography7 nm
Processor familyAMD Ryzen™ 7
Processor cores8
Processor socketSocket AM4
Processor cache typeL3
Package typeBox
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Non-ECCYes
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)105 W
Technical details
Intel® Hyper Threading Technology (Intel® HT Technology)No
PCI Express slots version4.0
Thermal Design Power (TDP)105 W
Market segmentDesktop
Processor cache typeL3
Features
Thermal Design Power (TDP)105 W
PCI Express slots version4.0
Market segmentDesktop
Harmonized System (HS) code85423119
Processor special features
Intel® Hyper Threading Technology (Intel® HT Technology)No
Packaging data
Package typeBox
Logistics data
Harmonized System (HS) code85423119
Processor family
AMD EPYC
Intel Xeon Silver
AMD EPYC
AMD EPYC
AMD EPYC
AMD Ryzen 7
On-board graphics card
N/A
N
N
N
N
N
Discrete graphics card
N/A
N
N
N
N
N
Processor lithography
N/A
up to 22nm
up to 22nm
up to 22nm
N/A
up to 22nm
Processor cores
16
8
8
32
24
8
Processor socket
Socket SP3
LGA 3647 (Socket P)
Socket SP3
Socket SP3
Socket SP3
Socket AM4
Cooler included
N/A
N/A
N
N
N
N
Package type
N/A
N/A
Tray
Tray
Tray
Box