Lenovo Intel Xeon Silver 4208 Processor Option Kit for ThinkSystem SR550/SR590/SR650

SKU

4XG7A37935

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Available on backorder

Intel Xeon Silver 4208 Processor Option Kit for Lenovo ThinkSystem SR550/SR590/SR650

Category: Processors

More Information

More Information
Processor socket	LGA 3647 (Socket P)
Processor cores	8
Processor family	Intel Xeon Silver
Processor lithography	14 nm
SKU	4XG7A37935
EAN	0889488497720
Manufacturer	Lenovo
Availability	Out of Stock

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Description

Processor Option Kit for ThinkSystem server for small businesses up to large enterprises that need industry-leading reliability, management, and security, as well as maximizing performance and flexibility for future growth.

Specifications

Processor
Processor generation	2nd Generation Intel® Xeon® Scalable
Processor base frequency	2.1 GHz
Processor codename	Cascade Lake
Thermal Design Power (TDP)	85 W
Processor cache	11 MB
Processor model	4208
Processor threads	16
Processor operating modes	64-bit
Processor boost frequency	3.2 GHz
Bus type	UPI
Component for	Server/workstation
Processor lithography	14 nm
Processor family	Intel Xeon Silver
Processor cores	8
Processor socket	LGA 3647 (Socket P)
Processor series	Intel Xeon Silver 4000 Series
Processor cache type	Smart Cache
Memory
Maximum internal memory supported by processor	1 TB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2400 MHz
Memory channels	Hexa-channel
ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	85 W
Technical details
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Execute Disable Bit	Yes
Enhanced Intel SpeedStep Technology	Yes
PCI Express slots version	3.0
Supported instruction sets	AVX-512
Scalability	2S
Intel VT-x with Extended Page Tables (EPT)	Yes
Embedded options available	No
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Thermal Design Power (TDP)	85 W
Processor series	Intel Xeon Silver 4000 Series
Market segment	Server
Intel Virtualization Technology (VT-x)	Yes
Processor cache type	Smart Cache

Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	85 W
Processor package size	76 x 56.5 mm
Execute Disable Bit	Yes
PCI Express slots version	3.0
Supported instruction sets	AVX-512
Scalability	2S
Embedded options available	No
Market segment	Server
Harmonized System (HS) code	85423119
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Intel Turbo Boost Max Technology 3.0	No
Intel® Speed Shift Technology	Yes
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Enhanced Intel SpeedStep Technology	Yes
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Virtualization Technology (VT-x)	Yes
Intel® vPro™ Platform Eligibility	Yes
Operational conditions
Tcase	78 °C
Logistics data
Harmonized System (HS) code	85423119
Weight & dimensions
Processor package size	76 x 56.5 mm
Other features
Compatibility	ThinkSystem SR550, ThinkSystem SR590, ThinkSystem SR650

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SKU

4XG7A37935

100-000000054

100-000000141

100-100000063WOF

100-000000319

100-000000339

Manufacturer

Lenovo

AMD

Specification

Processor
Processor generation	2nd Generation Intel® Xeon® Scalable
Processor base frequency	2.1 GHz
Processor codename	Cascade Lake
Thermal Design Power (TDP)	85 W
Processor cache	11 MB
Processor model	4208
Processor threads	16
Processor operating modes	64-bit
Processor boost frequency	3.2 GHz
Bus type	UPI
Component for	Server/workstation
Processor lithography	14 nm
Processor family	Intel Xeon Silver
Processor cores	8
Processor socket	LGA 3647 (Socket P)
Processor series	Intel Xeon Silver 4000 Series
Processor cache type	Smart Cache
Memory
Maximum internal memory supported by processor	1 TB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2400 MHz
Memory channels	Hexa-channel
ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	85 W
Technical details
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Execute Disable Bit	Yes
Enhanced Intel SpeedStep Technology	Yes
PCI Express slots version	3.0
Supported instruction sets	AVX-512
Scalability	2S
Intel VT-x with Extended Page Tables (EPT)	Yes
Embedded options available	No
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Thermal Design Power (TDP)	85 W
Processor series	Intel Xeon Silver 4000 Series
Market segment	Server
Intel Virtualization Technology (VT-x)	Yes
Processor cache type	Smart Cache
Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	85 W
Processor package size	76 x 56.5 mm
Execute Disable Bit	Yes
PCI Express slots version	3.0
Supported instruction sets	AVX-512
Scalability	2S
Embedded options available	No
Market segment	Server
Harmonized System (HS) code	85423119
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Intel Turbo Boost Max Technology 3.0	No
Intel® Speed Shift Technology	Yes
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Enhanced Intel SpeedStep Technology	Yes
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Virtualization Technology (VT-x)	Yes
Intel® vPro™ Platform Eligibility	Yes
Operational conditions
Tcase	78 °C
Logistics data
Harmonized System (HS) code	85423119
Weight & dimensions
Processor package size	76 x 56.5 mm
Other features
Compatibility	ThinkSystem SR550, ThinkSystem SR590, ThinkSystem SR650

Processor
Processor base frequency	2.5 GHz
Processor manufacturer	AMD
Cooler included	No
Thermal Design Power (TDP)	180 W
Processor cache	128 MB
Processor model	7502
Processor threads	64
Processor operating modes	32-bit
Processor boost frequency	3.35 GHz
Component for	Server/workstation
Processor lithography	7 nm
Processor family	AMD EPYC
Processor cores	32
Processor socket	Socket SP3
Processor cache type	L3
Package type	Tray
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	180 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	180 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	180 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Packaging data
Package type	Tray
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor base frequency	3.2 GHz
Processor manufacturer	AMD
Cooler included	No
Thermal Design Power (TDP)	240 W
Processor cache	192 MB
Processor model	7F72
Processor threads	48
Processor operating modes	64-bit
Processor boost frequency	3.7 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	24
Processor socket	Socket SP3
Processor cache type	L3
Package type	Tray
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	240 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	240 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	240 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Packaging data
Package type	Tray
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor generation	AMD Ryzen 5000 Series
Processor base frequency	3.8 GHz
Processor manufacturer	AMD
Cooler included	No
Thermal Design Power (TDP)	105 W
Processor cache	32 MB
Processor model	5800X
Processor threads	16
Processor operating modes	64-bit
Processor boost frequency	4.7 GHz
Component for	PC
Processor lithography	7 nm
Processor family	AMD Ryzen™ 7
Processor cores	8
Processor socket	Socket AM4
Processor cache type	L3
Package type	Box
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Non-ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	105 W
Technical details
Intel® Hyper Threading Technology (Intel® HT Technology)	No
PCI Express slots version	4.0
Thermal Design Power (TDP)	105 W
Market segment	Desktop
Processor cache type	L3
Features
Thermal Design Power (TDP)	105 W
PCI Express slots version	4.0
Market segment	Desktop
Harmonized System (HS) code	85423119
Processor special features
Intel® Hyper Threading Technology (Intel® HT Technology)	No
Packaging data
Package type	Box
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor base frequency	2.75 GHz
Processor manufacturer	AMD
Thermal Design Power (TDP)	225 W
Processor cache	64 MB
Processor model	7453
Processor threads	56
Processor boost frequency	3.45 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	28
Processor socket	Socket SP3
Configurable TDP-up	240 W
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Power
Thermal Design Power (TDP)	225 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	225 W
Market segment	Server
Configurable TDP-up	240 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	225 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Processor special features
Configurable TDP-up	240 W
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor base frequency	3 GHz
Processor manufacturer	AMD
Configurable TDP-down	155 W
Thermal Design Power (TDP)	155 W
Processor cache	128 MB
Processor model	7313P
Processor threads	32
Processor boost frequency	3.7 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	16
Processor socket	Socket SP3
Configurable TDP-up	180 W
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Power
Configurable TDP-down	155 W
Thermal Design Power (TDP)	155 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	155 W
Market segment	Server
Configurable TDP-up	180 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	155 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Processor special features
Configurable TDP-up	180 W
Logistics data
Harmonized System (HS) code	85423119

Processor family

Intel Xeon Silver

AMD EPYC

AMD Ryzen 7

AMD EPYC

On-board graphics card

N/A

Discrete graphics card

N/A

Processor lithography

up to 22nm

N/A

up to 22nm

N/A

Processor cores

Processor socket

LGA 3647 (Socket P)

Socket SP3

Socket AM4

Socket SP3

Cooler included

N/A

Package type

N/A

Tray

Box

N/A