AMD EPYC 7513 processor 2.6 GHz 128 MB L3

SKU

100-000000334

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Available on backorder

32 cores, 64 threads, 2.6 GHz base frequency, 3.65 GHz boost frequency, 128MB L3 cache, 200W TDP

Category: Processors

More Information

More Information
Processor socket	Socket SP3
Processor cores	32
Processor family	AMD EPYC
SKU	100-000000334
EAN	5054444409672
Manufacturer	AMD
Availability	Out of Stock
Product Family	EPYC

Reviews

Nickname

Summary

Review

Specifications

Processor
Processor base frequency	2.6 GHz
Processor manufacturer	AMD
Configurable TDP-down	165 W
Thermal Design Power (TDP)	200 W
Processor cache	128 MB
Processor model	7513
Processor threads	64
Processor boost frequency	3.65 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	32
Processor socket	Socket SP3
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Power
Configurable TDP-down	165 W
Thermal Design Power (TDP)	200 W

Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	200 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	200 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Logistics data
Harmonized System (HS) code	85423119

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SKU

100-000000334

100-000000054

100-000000141

100-000000313

4XG7A63443

100-100000446WOF

Manufacturer

AMD

Lenovo

AMD

Specification

Processor
Processor base frequency	2.6 GHz
Processor manufacturer	AMD
Configurable TDP-down	165 W
Thermal Design Power (TDP)	200 W
Processor cache	128 MB
Processor model	7513
Processor threads	64
Processor boost frequency	3.65 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	32
Processor socket	Socket SP3
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Power
Configurable TDP-down	165 W
Thermal Design Power (TDP)	200 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	200 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	200 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor base frequency	2.5 GHz
Processor manufacturer	AMD
Cooler included	No
Thermal Design Power (TDP)	180 W
Processor cache	128 MB
Processor model	7502
Processor threads	64
Processor operating modes	32-bit
Processor boost frequency	3.35 GHz
Component for	Server/workstation
Processor lithography	7 nm
Processor family	AMD EPYC
Processor cores	32
Processor socket	Socket SP3
Processor cache type	L3
Package type	Tray
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	180 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	180 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	180 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Packaging data
Package type	Tray
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor base frequency	3.2 GHz
Processor manufacturer	AMD
Cooler included	No
Thermal Design Power (TDP)	240 W
Processor cache	192 MB
Processor model	7F72
Processor threads	48
Processor operating modes	64-bit
Processor boost frequency	3.7 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	24
Processor socket	Socket SP3
Processor cache type	L3
Package type	Tray
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	240 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	240 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	240 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Packaging data
Package type	Tray
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor base frequency	2.95 GHz
Processor manufacturer	AMD
Thermal Design Power (TDP)	280 W
Processor cache	256 MB
Processor model	75F3
Processor threads	64
Processor boost frequency	4 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	32
Processor socket	Socket SP3
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Power
Thermal Design Power (TDP)	280 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	280 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	280 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor generation	3rd Generation Intel® Xeon® Scalable
Processor base frequency	2.8 GHz
Processor manufacturer	Intel
Processor codename	Ice Lake
Thermal Design Power (TDP)	105 W
Processor cache	12 MB
Processor ARK ID	215275
Processor model	4309Y
Processor threads	16
System bus rate	10.4 GT/s
Processor operating modes	64-bit
Processor boost frequency	3.6 GHz
Component for	Server/workstation
Processor lithography	10 nm
Processor family	Intel Xeon Silver
Processor cores	8
Processor socket	LGA 4189
Package type	Box
Memory
Maximum internal memory supported by processor	6.14 TB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2667 MHz
Supported memory types	DDR4-SDRAM
Memory channels	Octa-channel
ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	105 W
Technical details
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Execute Disable Bit	Yes
PCI Express slots version	4.0
Supported instruction sets	SSE4.2, AVX, AVX 2.0, AVX-512
Scalability	2S
Intel VT-x with Extended Page Tables (EPT)	Yes
Embedded options available	No
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Thermal Design Power (TDP)	105 W
Supported memory types	DDR4-SDRAM
Status	Launched
Market segment	Server
Launch date	Q2'21
Intel Virtualization Technology (VT-x)	Yes
Number of UPI links	2
Memory speed (max)	2667 MHz
AVX-512 Fused Multiply-Add (FMA) units	2
Features
Maximum number of PCI Express lanes	64
Thermal Design Power (TDP)	105 W
Processor package size	77.5 x 56.5 mm
Processor ARK ID	215275
Execute Disable Bit	Yes
PCI Express slots version	4.0
Supported instruction sets	SSE4.2, AVX, AVX 2.0, AVX-512
Scalability	2S
Embedded options available	No
Market segment	Server
Harmonized System (HS) code	85423119
Export Control Classification Number (ECCN)	5A992CN3
Commodity Classification Automated Tracking System (CCATS)	G178966
Processor special features
Intel Software Guard Extensions (Intel SGX)	Yes
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Intel® Speed Shift Technology	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Virtualization Technology (VT-x)	Yes
AVX-512 Fused Multiply-Add (FMA) units	2
Intel® Volume Management Device (VMD)	Yes
Intel® Speed Select technology - Performance Profile (Intel® SST-PP)	Yes
Intel® Optane™ DC Persistent Memory Supported	No
Intel® Deep Learning Boost (Intel® DL Boost) on CPU	Yes
Mode-based Execute Control (MBE)	Yes
Intel® Resource Director Technology (Intel® RDT)	Yes
Intel® Transactional Synchronization Extensions	Yes
Intel® Total Memory Encryption	Yes
Maximum Enclave Size Support for Intel® SGX	8 GB
Intel® Platform Firmware Resilience Support	Yes
Intel® Crypto Acceleration	Yes
Operational conditions
Tcase	76 °C
Packaging data
Package type	Box
Logistics data
Harmonized System (HS) code	85423119
Weight & dimensions
Processor package size	77.5 x 56.5 mm
Other features
Maximum internal memory	6 TB

Processor
Processor generation	AMD Ryzen Threadripper PRO 5000 WX-Series
Processor base frequency	3.8 GHz
Processor manufacturer	AMD
Cooler included	No
Thermal Design Power (TDP)	280 W
Processor cache	128 MB
Processor model	5965WX
Processor threads	48
Processor operating modes	64-bit
Processor boost frequency	4.5 GHz
Processor lithography	7 nm
Processor family	AMD Ryzen Threadripper PRO
Processor cores	24
Processor cache type	L3
Package type	Box
Memory
Memory types supported by processor	DDR4-SDRAM
Memory channels	Octa-channel
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	280 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	280 W
Market segment	Desktop
Processor cache type	L3
Features
Thermal Design Power (TDP)	280 W
PCI Express slots version	4.0
Market segment	Desktop
Harmonized System (HS) code	85423119
Packaging data
Package type	Box
Logistics data
Harmonized System (HS) code	85423119

Processor family

AMD EPYC

Intel Xeon Silver

AMD Ryzen Threadripper PRO

On-board graphics card

N/A

Discrete graphics card

N/A

Processor lithography

N/A

up to 22nm

N/A

up to 22nm

Processor cores

Processor socket

Socket SP3

LGA 4189

N/A

Cooler included

N/A

Package type

N/A

Tray

N/A

Box