Lenovo Xeon Intel Silver 4309Y processor 2.8 GHz 12 MB Box

SKU
4XG7A63443
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Available on backorder
SR650 V2 Intel Xeon Silver 4309Y 8C 105W 2.8GHz Option Kit w/o Fan
More Information
Processor socket LGA 4189
Processor cores 8
Processor family Intel Xeon Silver
Processor lithography 10 nm
SKU 4XG7A63443
EAN 0889488531202
Manufacturer Lenovo
Availability Out of Stock
Product Family Xeon
Intel® Turbo Boost Technology

Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t..

Intel® Hyper-Threading Technology

Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Intel® Virtualization Technology (VT-x)

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® VT-x with Extended Page Tables (EPT)

Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.

Intel® 64

Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Instruction Set Extensions

Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

# of AVX-512 FMA Units

Intel® Advanced Vector Extensions 512 (AVX-512), new instruction set extensions, delivering ultra-wide (512-bit) vector operations capabilities, with up to 2 FMAs (Fused Multiply Add instructions), to accelerate performance for your most demanding computational tasks.

Intel® Speed Shift Technology

Intel® Speed Shift Technology uses hardware-controlled P-states to deliver dramatically quicker responsiveness with single-threaded, transient (short duration) workloads, such as web browsing, by allowing the processor to more quickly select its best operating frequency and voltage for optimal performance and power efficiency.

Intel® Deep Learning Boost (Intel® DL Boost)

A new set of embedded processor technologies designed to accelerate AI deep learning use cases. It extends Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly increases deep learning inference performance over previous generations.

Intel® Speed Select technology - Performance Profile

A capability to configure the processor to run at three distinct operating points.

Intel® Resource Director Technology (Intel® RDT)

Intel® RDT brings new levels of visibility and control over how shared resources such as last-level cache (LLC) and memory bandwidth are used by applications, virtual machines (VMs) and containers.

Intel® Volume Management Device (VMD)

Intel® Volume Management Device (VMD) provides a common, robust method of hot plug and LED management for NVMe-based solid state drives.
Processor
Processor generation3rd Generation Intel® Xeon® Scalable
Processor base frequency2.8 GHz
Processor manufacturerIntel
Processor codenameIce Lake
Thermal Design Power (TDP)105 W
Processor cache12 MB
Processor ARK ID215275
Processor model4309Y
Processor threads16
System bus rate10.4 GT/s
Processor operating modes64-bit
Processor boost frequency3.6 GHz
Component forServer/workstation
Processor lithography10 nm
Processor familyIntel Xeon Silver
Processor cores8
Processor socketLGA 4189
Package typeBox
Memory
Maximum internal memory supported by processor6.14 TB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2667 MHz
Supported memory typesDDR4-SDRAM
Memory channelsOcta-channel
ECCYes
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)105 W
Technical details
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Execute Disable BitYes
PCI Express slots version4.0
Supported instruction setsSSE4.2, AVX, AVX 2.0, AVX-512
Scalability2S
Intel VT-x with Extended Page Tables (EPT)Yes
Embedded options availableNo
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Thermal Design Power (TDP)105 W
Supported memory typesDDR4-SDRAM
StatusLaunched
Market segmentServer
Launch dateQ2'21
Intel Virtualization Technology (VT-x)Yes
Number of UPI links2
Memory speed (max)2667 MHz
AVX-512 Fused Multiply-Add (FMA) units2
Features
Maximum number of PCI Express lanes64
Thermal Design Power (TDP)105 W
Processor package size77.5 x 56.5 mm
Processor ARK ID215275
Execute Disable BitYes
PCI Express slots version4.0
Supported instruction setsSSE4.2, AVX, AVX 2.0, AVX-512
Scalability2S
Embedded options availableNo
Market segmentServer
Harmonized System (HS) code85423119
Export Control Classification Number (ECCN)5A992CN3
Commodity Classification Automated Tracking System (CCATS)G178966
Processor special features
Intel Software Guard Extensions (Intel SGX)Yes
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Intel® Speed Shift TechnologyYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Virtualization Technology (VT-x)Yes
AVX-512 Fused Multiply-Add (FMA) units2
Intel® Volume Management Device (VMD)Yes
Intel® Speed Select technology - Performance Profile (Intel® SST-PP)Yes
Intel® Optane™ DC Persistent Memory SupportedNo
Intel® Deep Learning Boost (Intel® DL Boost) on CPUYes
Mode-based Execute Control (MBE)Yes
Intel® Resource Director Technology (Intel® RDT)Yes
Intel® Transactional Synchronization ExtensionsYes
Intel® Total Memory EncryptionYes
Maximum Enclave Size Support for Intel® SGX8 GB
Intel® Platform Firmware Resilience SupportYes
Intel® Crypto AccelerationYes
Operational conditions
Tcase76 °C
Packaging data
Package typeBox
Logistics data
Harmonized System (HS) code85423119
Weight & dimensions
Processor package size77.5 x 56.5 mm
Other features
Maximum internal memory6 TB

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SKU
4XG7A63443
100-000000079
100-000000141
100-000000312
100-000000341
100-000000339
Manufacturer
Lenovo
AMD
AMD
AMD
AMD
AMD
Specification
Processor
Processor generation3rd Generation Intel® Xeon® Scalable
Processor base frequency2.8 GHz
Processor manufacturerIntel
Processor codenameIce Lake
Thermal Design Power (TDP)105 W
Processor cache12 MB
Processor ARK ID215275
Processor model4309Y
Processor threads16
System bus rate10.4 GT/s
Processor operating modes64-bit
Processor boost frequency3.6 GHz
Component forServer/workstation
Processor lithography10 nm
Processor familyIntel Xeon Silver
Processor cores8
Processor socketLGA 4189
Package typeBox
Memory
Maximum internal memory supported by processor6.14 TB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2667 MHz
Supported memory typesDDR4-SDRAM
Memory channelsOcta-channel
ECCYes
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)105 W
Technical details
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Execute Disable BitYes
PCI Express slots version4.0
Supported instruction setsSSE4.2, AVX, AVX 2.0, AVX-512
Scalability2S
Intel VT-x with Extended Page Tables (EPT)Yes
Embedded options availableNo
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Thermal Design Power (TDP)105 W
Supported memory typesDDR4-SDRAM
StatusLaunched
Market segmentServer
Launch dateQ2'21
Intel Virtualization Technology (VT-x)Yes
Number of UPI links2
Memory speed (max)2667 MHz
AVX-512 Fused Multiply-Add (FMA) units2
Features
Maximum number of PCI Express lanes64
Thermal Design Power (TDP)105 W
Processor package size77.5 x 56.5 mm
Processor ARK ID215275
Execute Disable BitYes
PCI Express slots version4.0
Supported instruction setsSSE4.2, AVX, AVX 2.0, AVX-512
Scalability2S
Embedded options availableNo
Market segmentServer
Harmonized System (HS) code85423119
Export Control Classification Number (ECCN)5A992CN3
Commodity Classification Automated Tracking System (CCATS)G178966
Processor special features
Intel Software Guard Extensions (Intel SGX)Yes
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Intel® Speed Shift TechnologyYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Virtualization Technology (VT-x)Yes
AVX-512 Fused Multiply-Add (FMA) units2
Intel® Volume Management Device (VMD)Yes
Intel® Speed Select technology - Performance Profile (Intel® SST-PP)Yes
Intel® Optane™ DC Persistent Memory SupportedNo
Intel® Deep Learning Boost (Intel® DL Boost) on CPUYes
Mode-based Execute Control (MBE)Yes
Intel® Resource Director Technology (Intel® RDT)Yes
Intel® Transactional Synchronization ExtensionsYes
Intel® Total Memory EncryptionYes
Maximum Enclave Size Support for Intel® SGX8 GB
Intel® Platform Firmware Resilience SupportYes
Intel® Crypto AccelerationYes
Operational conditions
Tcase76 °C
Packaging data
Package typeBox
Logistics data
Harmonized System (HS) code85423119
Weight & dimensions
Processor package size77.5 x 56.5 mm
Other features
Maximum internal memory6 TB
Processor
Processor base frequency2.9 GHz
Processor manufacturerAMD
Cooler includedNo
Thermal Design Power (TDP)120 W
Processor cache64 MB
Processor model7272
Processor threads24
Processor operating modes32-bit
Processor boost frequency3.2 GHz
Component forServer/workstation
Processor lithography7 nm
Processor familyAMD EPYC
Processor cores12
Processor socketSocket SP3
Processor cache typeL3
Package typeTray
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
Memory bandwidth (max)85.3 GB/s
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)120 W
Technical details
PCI Express slots version4.0
Thermal Design Power (TDP)120 W
Market segmentServer
Processor cache typeL3
Features
Maximum number of PCI Express lanes128
Thermal Design Power (TDP)120 W
PCI Express slots version4.0
Market segmentServer
Harmonized System (HS) code85423119
Packaging data
Package typeTray
Logistics data
Harmonized System (HS) code85423119
Processor
Processor base frequency3.2 GHz
Processor manufacturerAMD
Cooler includedNo
Thermal Design Power (TDP)240 W
Processor cache192 MB
Processor model7F72
Processor threads48
Processor operating modes64-bit
Processor boost frequency3.7 GHz
Component forServer/workstation
Processor familyAMD EPYC
Processor cores24
Processor socketSocket SP3
Processor cache typeL3
Package typeTray
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
Memory bandwidth (max)204.8 GB/s
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)240 W
Technical details
PCI Express slots version4.0
Thermal Design Power (TDP)240 W
Market segmentServer
Processor cache typeL3
Features
Maximum number of PCI Express lanes128
Thermal Design Power (TDP)240 W
PCI Express slots version4.0
Market segmentServer
Harmonized System (HS) code85423119
Packaging data
Package typeTray
Logistics data
Harmonized System (HS) code85423119
Processor
Processor base frequency2.45 GHz
Processor manufacturerAMD
Thermal Design Power (TDP)280 W
Processor cache256 MB
Processor model7763
Processor threads128
Processor boost frequency3.5 GHz
L3 cache speed280 GHz
Component forServer/workstation
Processor familyAMD EPYC
Processor cores64
Processor socketSocket SP3
Processor cache typeL3
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
Memory bandwidth (max)204.8 GB/s
Power
Thermal Design Power (TDP)280 W
Technical details
PCI Express slots version4.0
L3 cache speed280 GHz
Thermal Design Power (TDP)280 W
Market segmentServer
Processor cache typeL3
Features
Maximum number of PCI Express lanes128
Thermal Design Power (TDP)280 W
PCI Express slots version4.0
Market segmentServer
Harmonized System (HS) code85423119
Logistics data
Harmonized System (HS) code85423119
Processor
Processor base frequency2.8 GHz
Processor manufacturerAMD
Configurable TDP-down225 W
Thermal Design Power (TDP)225 W
Processor cache256 MB
Processor model7543P
Processor threads64
Processor boost frequency3.7 GHz
Component forServer/workstation
Processor familyAMD EPYC
Processor cores32
Processor socketSocket SP3
Configurable TDP-up240 W
Processor cache typeL3
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
Memory bandwidth (max)204.8 GB/s
Power
Configurable TDP-down225 W
Thermal Design Power (TDP)225 W
Technical details
PCI Express slots version4.0
Thermal Design Power (TDP)225 W
Market segmentServer
Configurable TDP-up240 W
Processor cache typeL3
Features
Maximum number of PCI Express lanes128
Thermal Design Power (TDP)225 W
PCI Express slots version4.0
Market segmentServer
Harmonized System (HS) code85423119
Processor special features
Configurable TDP-up240 W
Logistics data
Harmonized System (HS) code85423119
Processor
Processor base frequency3 GHz
Processor manufacturerAMD
Configurable TDP-down155 W
Thermal Design Power (TDP)155 W
Processor cache128 MB
Processor model7313P
Processor threads32
Processor boost frequency3.7 GHz
Component forServer/workstation
Processor familyAMD EPYC
Processor cores16
Processor socketSocket SP3
Configurable TDP-up180 W
Processor cache typeL3
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
Memory bandwidth (max)204.8 GB/s
Power
Configurable TDP-down155 W
Thermal Design Power (TDP)155 W
Technical details
PCI Express slots version4.0
Thermal Design Power (TDP)155 W
Market segmentServer
Configurable TDP-up180 W
Processor cache typeL3
Features
Maximum number of PCI Express lanes128
Thermal Design Power (TDP)155 W
PCI Express slots version4.0
Market segmentServer
Harmonized System (HS) code85423119
Processor special features
Configurable TDP-up180 W
Logistics data
Harmonized System (HS) code85423119
Processor family
Intel Xeon Silver
AMD EPYC
AMD EPYC
AMD EPYC
AMD EPYC
AMD EPYC
On-board graphics card
N
N
N
N/A
N/A
N/A
Discrete graphics card
N
N
N
N/A
N/A
N/A
Processor lithography
up to 22nm
up to 22nm
N/A
N/A
N/A
N/A
Processor cores
8
12
24
64
32
16
Processor socket
LGA 4189
Socket SP3
Socket SP3
Socket SP3
Socket SP3
Socket SP3
Cooler included
N/A
N
N
N/A
N/A
N/A
Package type
Box
Tray
Tray
N/A
N/A
N/A