AMD Ryzen 7 5700G processor 3.8 GHz 16 MB L3 Box

SKU

100-100000263BOX

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In Stock:325 available

AM4, 8 cores, 16 threads, 3.8 GHz base clock, 4.6 GHz boost clock, 16 MB cache, 65 W

Category: Processors

More Information

More Information
Processor socket	Socket AM4
Box	Yes
Processor cores	8
Processor family	AMD Ryzen 7
SKU	100-100000263BOX
EAN	0730143313377
Manufacturer	AMD
Availability	In Stock
Product Family	Ryzen
Product Series	7

Reviews

Nickname

Summary

Review

Description

Performance you deserve
AMD Ryzen™ 5000 Series desktop processors power the most demanding games and help obliterate multithreaded tasks like 3D or video rendering and software compiling. With the Ryzen processors included in this bundle offer, get up to 16 cores, 32 threads, boost clocks of up to 4.9GHz1 and up to 100MB of cache, AMD Ryzen™ 5000 Series processors deliver game-changing performance.

Win with the latest technologies
Game with confidence. AMD Ryzen™ 5000 Series desktop processors deliver incredible performance with bleeding-edge technologies, including Precision Boost 2 and Precision Boost Overdrive.2,3 Cool under pressure, these processors continue the AMD Ryzen™ processor tradition of exceptional 7nm “Zen 3” architecture performance per watt.

The ultimate build
Configuring and customizing your rig has never been easier. AMD Ryzen™ 5000 Series desktop processors are drop-in ready on AMD 500, 400 and select 300 Series motherboards with a simple BIOS update. They’re also ready to be tweaked and fine-tuned using Ryzen™ Master. Want to jump in the game faster? Download AMD StoreMI to get HDD storage at SSD speeds.

Specifications

Processor
Processor generation	AMD Ryzen 5000 Series
Processor base frequency	3.8 GHz
Processor manufacturer	AMD
Cooler included	Yes
Configurable TDP-down	45 W
Thermal Design Power (TDP)	65 W
Processor cache	16 MB
Processor model	5700G
Processor threads	16
Processor operating modes	64-bit
Processor boost frequency	4.6 GHz
Component for	PC
Processor lithography	7 nm
Processor family	AMD Ryzen™ 7
Processor cores	8
Processor socket	Socket AM4
Configurable TDP-up	65 W
Processor cache type	L3
Package type	Box
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Dual-channel
Non-ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card model	AMD Radeon Graphics
On-board graphics card	Yes
On-board graphics card base frequency	2000 MHz
Discrete graphics card model	Not available
Power
Configurable TDP-down	45 W
Thermal Design Power (TDP)	65 W

Technical details
Intel® Hyper Threading Technology (Intel® HT Technology)	No
PCI Express slots version	3.0
Thermal Design Power (TDP)	65 W
Market segment	Desktop
Configurable TDP-up	65 W
Processor cache type	L3
Features
Thermal Design Power (TDP)	65 W
PCI Express slots version	3.0
Market segment	Desktop
Harmonized System (HS) code	85423119
Processor special features
Intel® Hyper Threading Technology (Intel® HT Technology)	No
Configurable TDP-up	65 W
Packaging data
Package type	Box
Logistics data
Harmonized System (HS) code	85423119

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SKU

100-100000263BOX

4XG7A37935

P02491-B21

P10938-B21

100-000000080

100-000000041

Manufacturer

AMD

Lenovo

HPE

AMD

Specification

Processor
Processor generation	AMD Ryzen 5000 Series
Processor base frequency	3.8 GHz
Processor manufacturer	AMD
Cooler included	Yes
Configurable TDP-down	45 W
Thermal Design Power (TDP)	65 W
Processor cache	16 MB
Processor model	5700G
Processor threads	16
Processor operating modes	64-bit
Processor boost frequency	4.6 GHz
Component for	PC
Processor lithography	7 nm
Processor family	AMD Ryzen™ 7
Processor cores	8
Processor socket	Socket AM4
Configurable TDP-up	65 W
Processor cache type	L3
Package type	Box
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Dual-channel
Non-ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card model	AMD Radeon Graphics
On-board graphics card	Yes
On-board graphics card base frequency	2000 MHz
Discrete graphics card model	Not available
Power
Configurable TDP-down	45 W
Thermal Design Power (TDP)	65 W
Technical details
Intel® Hyper Threading Technology (Intel® HT Technology)	No
PCI Express slots version	3.0
Thermal Design Power (TDP)	65 W
Market segment	Desktop
Configurable TDP-up	65 W
Processor cache type	L3
Features
Thermal Design Power (TDP)	65 W
PCI Express slots version	3.0
Market segment	Desktop
Harmonized System (HS) code	85423119
Processor special features
Intel® Hyper Threading Technology (Intel® HT Technology)	No
Configurable TDP-up	65 W
Packaging data
Package type	Box
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor generation	2nd Generation Intel® Xeon® Scalable
Processor base frequency	2.1 GHz
Processor codename	Cascade Lake
Thermal Design Power (TDP)	85 W
Processor cache	11 MB
Processor model	4208
Processor threads	16
Processor operating modes	64-bit
Processor boost frequency	3.2 GHz
Bus type	UPI
Component for	Server/workstation
Processor lithography	14 nm
Processor family	Intel Xeon Silver
Processor cores	8
Processor socket	LGA 3647 (Socket P)
Processor series	Intel Xeon Silver 4000 Series
Processor cache type	Smart Cache
Memory
Maximum internal memory supported by processor	1 TB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2400 MHz
Memory channels	Hexa-channel
ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	85 W
Technical details
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Execute Disable Bit	Yes
Enhanced Intel SpeedStep Technology	Yes
PCI Express slots version	3.0
Supported instruction sets	AVX-512
Scalability	2S
Intel VT-x with Extended Page Tables (EPT)	Yes
Embedded options available	No
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Thermal Design Power (TDP)	85 W
Processor series	Intel Xeon Silver 4000 Series
Market segment	Server
Intel Virtualization Technology (VT-x)	Yes
Processor cache type	Smart Cache
Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	85 W
Processor package size	76 x 56.5 mm
Execute Disable Bit	Yes
PCI Express slots version	3.0
Supported instruction sets	AVX-512
Scalability	2S
Embedded options available	No
Market segment	Server
Harmonized System (HS) code	85423119
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Intel Turbo Boost Max Technology 3.0	No
Intel® Speed Shift Technology	Yes
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Enhanced Intel SpeedStep Technology	Yes
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Virtualization Technology (VT-x)	Yes
Intel® vPro™ Platform Eligibility	Yes
Operational conditions
Tcase	78 °C
Logistics data
Harmonized System (HS) code	85423119
Weight & dimensions
Processor package size	76 x 56.5 mm
Other features
Compatibility	ThinkSystem SR550, ThinkSystem SR590, ThinkSystem SR650

Processor
Processor generation	2nd Generation Intel® Xeon® Scalable
Processor base frequency	2.1 GHz
Processor manufacturer	Intel
Cooler included	No
Processor codename	Cascade Lake
Thermal Design Power (TDP)	85 W
Processor cache	11 MB
Processor model	4208
Processor threads	16
Processor operating modes	64-bit
Processor boost frequency	3.2 GHz
Stepping	R1
Bus type	UPI
Component for	Server/workstation
Processor lithography	14 nm
Processor family	Intel Xeon Silver
Processor cores	8
Processor socket	LGA 3647 (Socket P)
Processor series	Intel Xeon Silver 4000 Series
Processor cache type	L3
Memory
Maximum internal memory supported by processor	1 TB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2400 MHz
Memory channels	Hexa-channel
ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card	No
Power
Thermal Design Power (TDP)	85 W
Technical details
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Execute Disable Bit	Yes
Enhanced Intel SpeedStep Technology	Yes
PCI Express slots version	3.0
Supported instruction sets	AVX-512
Scalability	2S
Intel VT-x with Extended Page Tables (EPT)	Yes
Embedded options available	No
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Thermal Design Power (TDP)	85 W
Processor series	Intel Xeon Silver 4000 Series
Market segment	Server
Intel Virtualization Technology (VT-x)	Yes
Processor cache type	L3
Number of UPI links	2
Mode-based Execute Control (MBE) version	Yes
Intel® Volume Management Device (VMD) version	Yes
Intel® Run Sure Technology version	No
AVX-512 Fused Multiply-Add (FMA) units	1
Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	85 W
Execute Disable Bit	Yes
PCI Express slots version	3.0
Supported instruction sets	AVX-512
Scalability	2S
Embedded options available	No
Market segment	Server
Intel® Optane™ Memory module included	No
Harmonized System (HS) code	85423119
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Intel Turbo Boost Max Technology 3.0	No
Intel® Speed Shift Technology	Yes
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Enhanced Intel SpeedStep Technology	Yes
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Virtualization Technology (VT-x)	Yes
AVX-512 Fused Multiply-Add (FMA) units	1
Intel® vPro™ Platform Eligibility	Yes
Operational conditions
Tcase	78 °C
Logistics data
Harmonized System (HS) code	85423119
Weight & dimensions
Width	174.8 mm
Weight	1.13 kg
Height	169.7 mm
Depth	285.7 mm
Other features
Compatibility	DL380 Gen10

Processor
Processor generation	2nd Generation Intel® Xeon® Scalable
Processor base frequency	2.1 GHz
Cooler included	No
Processor codename	Cascade Lake
Thermal Design Power (TDP)	85 W
Processor cache	11 MB
Processor model	4208
Processor threads	16
Processor operating modes	64-bit
Processor boost frequency	3.2 GHz
Stepping	R1
Bus type	UPI
Component for	Server/workstation
Processor lithography	14 nm
Processor family	Intel Xeon Silver
Processor cores	8
Processor socket	LGA 3647 (Socket P)
Processor series	Intel Xeon Silver 4000 Series
Processor cache type	L3
Memory
Maximum internal memory supported by processor	1 TB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2400 MHz
Memory channels	Hexa-channel
ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card	No
Power
Thermal Design Power (TDP)	85 W
Technical details
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Execute Disable Bit	Yes
Enhanced Intel SpeedStep Technology	Yes
PCI Express slots version	3.0
Supported instruction sets	AVX-512
Scalability	2S
Intel VT-x with Extended Page Tables (EPT)	Yes
Embedded options available	No
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Thermal Design Power (TDP)	85 W
Processor series	Intel Xeon Silver 4000 Series
Market segment	Server
Intel Virtualization Technology (VT-x)	Yes
Processor cache type	L3
Number of UPI links	2
Mode-based Execute Control (MBE) version	Yes
Intel® Volume Management Device (VMD) version	Yes
Intel® Run Sure Technology version	No
AVX-512 Fused Multiply-Add (FMA) units	1
Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	85 W
Execute Disable Bit	Yes
PCI Express slots version	3.0
Supported instruction sets	AVX-512
Scalability	2S
Embedded options available	No
Market segment	Server
Intel® Optane™ Memory module included	No
Harmonized System (HS) code	85423119
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Intel Turbo Boost Max Technology 3.0	No
Intel® Speed Shift Technology	Yes
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Enhanced Intel SpeedStep Technology	Yes
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Virtualization Technology (VT-x)	Yes
AVX-512 Fused Multiply-Add (FMA) units	1
Intel® vPro™ Platform Eligibility	Yes
Operational conditions
Tcase	78 °C
Logistics data
Harmonized System (HS) code	85423119
Other features
Compatibility	ML350 Gen10

Processor
Processor base frequency	3.1 GHz
Processor manufacturer	AMD
Cooler included	No
Thermal Design Power (TDP)	120 W
Processor cache	64 MB
Processor model	7252
Processor threads	16
Processor operating modes	32-bit
Processor boost frequency	3.2 GHz
Component for	Server/workstation
Processor lithography	7 nm
Processor family	AMD EPYC
Processor cores	8
Processor socket	Socket SP3
Processor cache type	L3
Package type	Tray
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	85.3 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	120 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	120 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	120 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Packaging data
Package type	Tray
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor base frequency	3.2 GHz
Processor manufacturer	AMD
Cooler included	No
Thermal Design Power (TDP)	155 W
Processor cache	128 MB
Processor model	7262
Processor threads	16
Processor operating modes	32-bit
Processor boost frequency	3.4 GHz
Component for	Server/workstation
Processor lithography	7 nm
Processor family	AMD EPYC
Processor cores	8
Processor socket	Socket SP3
Processor cache type	L3
Package type	Tray
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	155 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	155 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	155 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Packaging data
Package type	Tray
Logistics data
Harmonized System (HS) code	85423119

Processor family

AMD Ryzen 7

Intel Xeon Silver

AMD EPYC

On-board graphics card

Discrete graphics card

Processor lithography

up to 22nm

Processor cores

Processor socket

Socket AM4

LGA 3647 (Socket P)

Socket SP3

Cooler included

N/A

Package type

Box

N/A

Tray