Intel Core i3-12100F processor 12 MB Smart Cache Box

SKU
BX8071512100F
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In Stock:97 available
Intel Core i3-12100F Processor (12M Cache, up to 4.30 GHz)
More Information
Processor socket LGA 1700
Box Yes
Processor cores 4
Processor family Intel Core i3
SKU BX8071512100F
EAN 5032037238731
Manufacturer Intel
Availability In Stock
Product Family Core
Product Series i3
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® 64
Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Cache
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

Intel® AES New Instructions
Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Idle States
Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Intel® Turbo Boost Technology
Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Max Turbo Frequency
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Execute Disable Bit
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.

Intel® Hyper-Threading Technology
Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Intel® VT-x with Extended Page Tables (EPT)
Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.

Intel® Optane™ Memory Supported
Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration.

Enhanced Intel SpeedStep® Technology
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Secure Key
Intel® Secure Key consists of a digital random number generator that creates truly random numbers to strengthen encryption algorithms.

Intel® Speed Shift Technology
Intel® Speed Shift Technology uses hardware-controlled P-states to deliver dramatically quicker responsiveness with single-threaded, transient (short duration) workloads, such as web browsing, by allowing the processor to more quickly select its best operating frequency and voltage for optimal performance and power efficiency.

Intel® Deep Learning Boost (Intel® DL Boost) on CPU
A new set of embedded processor technologies designed to accelerate AI deep learning use cases. It extends Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly increases deep learning inference performance over previous generations.

Instruction Set Extensions
Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

Intel® Turbo Boost Max Technology 3.0
Intel® Turbo Boost Max Technology 3.0 identifies the best performing core(s) on a processor and provides increased performance on those cores through increasing frequency as needed by taking advantage of power and thermal headroom.

Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

Intel® Volume Management Device (VMD)
Intel® Volume Management Device (VMD) provides a common, robust method of hot plug and LED management for NVMe-based solid state drives.

Intel® Gaussian & Neural Accelerator
Intel® Gaussian & Neural Accelerator (GNA) is an ultra-low power accelerator block designed to run audio and speech-centric AI workloads. Intel® GNA is designed to run audio based neural networks at ultra-low power, while simultaneously relieving the CPU of this workload.

Mode-based Execute Control (MBEC)
Mode-based Execute Control can more reliably verify and enforce the integrity of kernel level code.

Intel® Boot Guard
Intel® Device Protection Technology with Boot Guard helps protect the system’s pre-OS environment from viruses and malicious software attacks.

Intel® Control-Flow Enforcement Technology
CET - Intel Control-flow Enforcement Technology (CET) helps protect against the misuse of legitimate code snippets through return-oriented programming (ROP) control-flow hijacking attacks.
Processor
Processor generation12th gen Intel® Core™ i3
Processor manufacturerIntel
Cooler includedYes
Processor codenameAlder Lake
Memory bandwidth supported by processor (max)76.8 GB/s
Processor cache12 MB
Processor ARK ID132223
Processor modeli3-12100F
Processor threads8
Processor operating modes64-bit
Processor boost frequency4.3 GHz
Bus typeDMI4
Processor familyIntel® Core™ i3
Processor cores4
Processor socketLGA 1700
Processor cache typeSmart Cache
Package typeBox
Performance cores4
Efficient cores0
Performance-core boost frequency4.3 GHz
Performance-core base frequency3.3 GHz
Processor base power58 W
Maximum turbo power89 W
Maximum number of DMI lanes8
Memory
Maximum internal memory supported by processor128 GB
Memory types supported by processorDDR4-SDRAM, DDR5-SDRAM
Memory bandwidth supported by processor (max)76.8 GB/s
Memory channelsDual-channel
Memory bandwidth (max)76.8 GB/s
Non-ECCYes
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Technical details
Intel® Secure KeyYes
Thermal Monitoring TechnologiesYes
Intel® Turbo Boost Technology2.0
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Idle StatesYes
Execute Disable BitYes
Enhanced Intel SpeedStep TechnologyYes
PCI Express slots version4.0, 5.0
PCI Express configurations1x16+1x4, 2x8+1x4
Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
Scalability1S
Intel VT-x with Extended Page Tables (EPT)Yes
Embedded options availableNo
CPU configuration (max)1
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
StatusLaunched
Market segmentDesktop
Launch dateQ1'22
Intel Virtualization Technology (VT-x)Yes
Processor cache typeSmart Cache
Features
Maximum number of PCI Express lanes20
Processor package size45 x 37.5 mm
Processor ARK ID132223
Thermal Monitoring TechnologiesYes
Idle StatesYes
Execute Disable BitYes
PCI Express slots version4.0, 5.0
PCI Express configurations1x16+1x4, 2x8+1x4
Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
Scalability1S
Embedded options availableNo
CPU configuration (max)1
Market segmentDesktop
Harmonized System (HS) code85423119
Export Control Classification Number (ECCN)5A992CN3
Commodity Classification Automated Tracking System (CCATS)G167599
Use conditionsPC/Client/Tablet
Direct Media Interface (DMI) Revision4.0
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Intel Turbo Boost Max Technology 3.0No
Intel® Speed Shift TechnologyYes
Intel® Optane™ Memory ReadyYes
Intel® OS GuardYes
Intel® Secure KeyYes
Intel® Turbo Boost Technology2.0
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Enhanced Intel SpeedStep TechnologyYes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Virtualization Technology (VT-x)Yes
Intel® Boot GuardYes
Intel® Volume Management Device (VMD)Yes
Intel® Deep Learning Boost (Intel® DL Boost) on CPUYes
Mode-based Execute Control (MBE)Yes
Intel® Control-flow Enforcement Technology (CET)Yes
Intel® Thread DirectorNo
Intel® Gaussian & Neural Accelerator (Intel® GNA) 3.0Yes
Intel® Standard Manageability (ISM)Yes
Operational conditions
Tjunction100 °C
Packaging data
Package typeBox
Logistics data
Harmonized System (HS) code85423119
Weight & dimensions
Processor package size45 x 37.5 mm
Other features
Maximum internal memory128 GB
CPU configuration (max)1

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SKU
BX8071512100F
4XG7A37935
P02491-B21
YD3200C5FHBOX
YD3200C5M4MFH
100-100000263BOX
Manufacturer
Intel
Lenovo
HPE
AMD
AMD
AMD
Specification
Processor
Processor generation12th gen Intel® Core™ i3
Processor manufacturerIntel
Cooler includedYes
Processor codenameAlder Lake
Memory bandwidth supported by processor (max)76.8 GB/s
Processor cache12 MB
Processor ARK ID132223
Processor modeli3-12100F
Processor threads8
Processor operating modes64-bit
Processor boost frequency4.3 GHz
Bus typeDMI4
Processor familyIntel® Core™ i3
Processor cores4
Processor socketLGA 1700
Processor cache typeSmart Cache
Package typeBox
Performance cores4
Efficient cores0
Performance-core boost frequency4.3 GHz
Performance-core base frequency3.3 GHz
Processor base power58 W
Maximum turbo power89 W
Maximum number of DMI lanes8
Memory
Maximum internal memory supported by processor128 GB
Memory types supported by processorDDR4-SDRAM, DDR5-SDRAM
Memory bandwidth supported by processor (max)76.8 GB/s
Memory channelsDual-channel
Memory bandwidth (max)76.8 GB/s
Non-ECCYes
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Technical details
Intel® Secure KeyYes
Thermal Monitoring TechnologiesYes
Intel® Turbo Boost Technology2.0
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Idle StatesYes
Execute Disable BitYes
Enhanced Intel SpeedStep TechnologyYes
PCI Express slots version4.0, 5.0
PCI Express configurations1x16+1x4, 2x8+1x4
Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
Scalability1S
Intel VT-x with Extended Page Tables (EPT)Yes
Embedded options availableNo
CPU configuration (max)1
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
StatusLaunched
Market segmentDesktop
Launch dateQ1'22
Intel Virtualization Technology (VT-x)Yes
Processor cache typeSmart Cache
Features
Maximum number of PCI Express lanes20
Processor package size45 x 37.5 mm
Processor ARK ID132223
Thermal Monitoring TechnologiesYes
Idle StatesYes
Execute Disable BitYes
PCI Express slots version4.0, 5.0
PCI Express configurations1x16+1x4, 2x8+1x4
Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
Scalability1S
Embedded options availableNo
CPU configuration (max)1
Market segmentDesktop
Harmonized System (HS) code85423119
Export Control Classification Number (ECCN)5A992CN3
Commodity Classification Automated Tracking System (CCATS)G167599
Use conditionsPC/Client/Tablet
Direct Media Interface (DMI) Revision4.0
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Intel Turbo Boost Max Technology 3.0No
Intel® Speed Shift TechnologyYes
Intel® Optane™ Memory ReadyYes
Intel® OS GuardYes
Intel® Secure KeyYes
Intel® Turbo Boost Technology2.0
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Enhanced Intel SpeedStep TechnologyYes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Virtualization Technology (VT-x)Yes
Intel® Boot GuardYes
Intel® Volume Management Device (VMD)Yes
Intel® Deep Learning Boost (Intel® DL Boost) on CPUYes
Mode-based Execute Control (MBE)Yes
Intel® Control-flow Enforcement Technology (CET)Yes
Intel® Thread DirectorNo
Intel® Gaussian & Neural Accelerator (Intel® GNA) 3.0Yes
Intel® Standard Manageability (ISM)Yes
Operational conditions
Tjunction100 °C
Packaging data
Package typeBox
Logistics data
Harmonized System (HS) code85423119
Weight & dimensions
Processor package size45 x 37.5 mm
Other features
Maximum internal memory128 GB
CPU configuration (max)1
Processor
Processor generation2nd Generation Intel® Xeon® Scalable
Processor base frequency2.1 GHz
Processor codenameCascade Lake
Thermal Design Power (TDP)85 W
Processor cache11 MB
Processor model4208
Processor threads16
Processor operating modes64-bit
Processor boost frequency3.2 GHz
Bus typeUPI
Component forServer/workstation
Processor lithography14 nm
Processor familyIntel Xeon Silver
Processor cores8
Processor socketLGA 3647 (Socket P)
Processor seriesIntel Xeon Silver 4000 Series
Processor cache typeSmart Cache
Memory
Maximum internal memory supported by processor1 TB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2400 MHz
Memory channelsHexa-channel
ECCYes
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)85 W
Technical details
Intel TSX-NIYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Execute Disable BitYes
Enhanced Intel SpeedStep TechnologyYes
PCI Express slots version3.0
Supported instruction setsAVX-512
Scalability2S
Intel VT-x with Extended Page Tables (EPT)Yes
Embedded options availableNo
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Thermal Design Power (TDP)85 W
Processor seriesIntel Xeon Silver 4000 Series
Market segmentServer
Intel Virtualization Technology (VT-x)Yes
Processor cache typeSmart Cache
Features
Maximum number of PCI Express lanes48
Thermal Design Power (TDP)85 W
Processor package size76 x 56.5 mm
Execute Disable BitYes
PCI Express slots version3.0
Supported instruction setsAVX-512
Scalability2S
Embedded options availableNo
Market segmentServer
Harmonized System (HS) code85423119
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Intel Turbo Boost Max Technology 3.0No
Intel® Speed Shift TechnologyYes
Intel TSX-NIYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Enhanced Intel SpeedStep TechnologyYes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Virtualization Technology (VT-x)Yes
Intel® vPro™ Platform EligibilityYes
Operational conditions
Tcase78 °C
Logistics data
Harmonized System (HS) code85423119
Weight & dimensions
Processor package size76 x 56.5 mm
Other features
CompatibilityThinkSystem SR550, ThinkSystem SR590, ThinkSystem SR650
Processor
Processor generation2nd Generation Intel® Xeon® Scalable
Processor base frequency2.1 GHz
Processor manufacturerIntel
Cooler includedNo
Processor codenameCascade Lake
Thermal Design Power (TDP)85 W
Processor cache11 MB
Processor model4208
Processor threads16
Processor operating modes64-bit
Processor boost frequency3.2 GHz
SteppingR1
Bus typeUPI
Component forServer/workstation
Processor lithography14 nm
Processor familyIntel Xeon Silver
Processor cores8
Processor socketLGA 3647 (Socket P)
Processor seriesIntel Xeon Silver 4000 Series
Processor cache typeL3
Memory
Maximum internal memory supported by processor1 TB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2400 MHz
Memory channelsHexa-channel
ECCYes
Graphics
Discrete graphics cardNo
On-board graphics cardNo
Power
Thermal Design Power (TDP)85 W
Technical details
Intel TSX-NIYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Execute Disable BitYes
Enhanced Intel SpeedStep TechnologyYes
PCI Express slots version3.0
Supported instruction setsAVX-512
Scalability2S
Intel VT-x with Extended Page Tables (EPT)Yes
Embedded options availableNo
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Thermal Design Power (TDP)85 W
Processor seriesIntel Xeon Silver 4000 Series
Market segmentServer
Intel Virtualization Technology (VT-x)Yes
Processor cache typeL3
Number of UPI links2
Mode-based Execute Control (MBE) versionYes
Intel® Volume Management Device (VMD) versionYes
Intel® Run Sure Technology versionNo
AVX-512 Fused Multiply-Add (FMA) units1
Features
Maximum number of PCI Express lanes48
Thermal Design Power (TDP)85 W
Execute Disable BitYes
PCI Express slots version3.0
Supported instruction setsAVX-512
Scalability2S
Embedded options availableNo
Market segmentServer
Intel® Optane™ Memory module includedNo
Harmonized System (HS) code85423119
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Intel Turbo Boost Max Technology 3.0No
Intel® Speed Shift TechnologyYes
Intel TSX-NIYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Enhanced Intel SpeedStep TechnologyYes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Virtualization Technology (VT-x)Yes
AVX-512 Fused Multiply-Add (FMA) units1
Intel® vPro™ Platform EligibilityYes
Operational conditions
Tcase78 °C
Logistics data
Harmonized System (HS) code85423119
Weight & dimensions
Width174.8 mm
Weight1.13 kg
Height169.7 mm
Depth285.7 mm
Other features
CompatibilityDL380 Gen10
Processor
Processor generationAMD Ryzen 3000 Series
Processor base frequency3.6 GHz
Processor manufacturerAMD
Cooler includedYes
Thermal Design Power (TDP)65 W
Processor cache4 MB
Processor model3200G
Processor threads4
Processor operating modes64-bit
Component forPC
Processor lithography12 nm
Processor familyAMD Ryzen™ 3
Processor cores4
Processor socketSocket AM4
Processor cache typeL3
Package typeBox
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2933 MHz
Memory channelsDual-channel
Graphics
Discrete graphics cardNo
On-board graphics card modelAMD Radeon Vega 8
On-board graphics cardYes
On-board graphics card dynamic frequency (max)1250 MHz
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)65 W
Features
Thermal Design Power (TDP)65 W
Market segmentDesktop
Harmonized System (HS) code85423119
Technical details
Thermal Design Power (TDP)65 W
Market segmentDesktop
Processor cache typeL3
Packaging data
Package typeBox
Logistics data
Harmonized System (HS) code85423119
Processor
Processor generationAMD Ryzen 3000 Series
Processor base frequency3.6 GHz
Processor manufacturerAMD
Cooler includedNo
Thermal Design Power (TDP)65 W
Processor cache4 MB
Processor model3200G
Processor threads4
Processor operating modes64-bit
Component forPC
Processor lithography12 nm
Processor familyAMD Ryzen™ 3
Processor cores4
Processor socketSocket AM4
Processor cache typeL3
Package typeTray
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2933 MHz
Memory channelsDual-channel
Graphics
Discrete graphics cardNo
On-board graphics card modelAMD Radeon Vega 8
On-board graphics cardYes
On-board graphics card dynamic frequency (max)1250 MHz
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)65 W
Features
Thermal Design Power (TDP)65 W
Market segmentDesktop
Technical details
Thermal Design Power (TDP)65 W
Market segmentDesktop
Processor cache typeL3
Packaging data
Package typeTray
Processor
Processor generationAMD Ryzen 5000 Series
Processor base frequency3.8 GHz
Processor manufacturerAMD
Cooler includedYes
Configurable TDP-down45 W
Thermal Design Power (TDP)65 W
Processor cache16 MB
Processor model5700G
Processor threads16
Processor operating modes64-bit
Processor boost frequency4.6 GHz
Component forPC
Processor lithography7 nm
Processor familyAMD Ryzen™ 7
Processor cores8
Processor socketSocket AM4
Configurable TDP-up65 W
Processor cache typeL3
Package typeBox
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsDual-channel
Non-ECCYes
Graphics
Discrete graphics cardNo
On-board graphics card modelAMD Radeon Graphics
On-board graphics cardYes
On-board graphics card base frequency2000 MHz
Discrete graphics card modelNot available
Power
Configurable TDP-down45 W
Thermal Design Power (TDP)65 W
Technical details
Intel® Hyper Threading Technology (Intel® HT Technology)No
PCI Express slots version3.0
Thermal Design Power (TDP)65 W
Market segmentDesktop
Configurable TDP-up65 W
Processor cache typeL3
Features
Thermal Design Power (TDP)65 W
PCI Express slots version3.0
Market segmentDesktop
Harmonized System (HS) code85423119
Processor special features
Intel® Hyper Threading Technology (Intel® HT Technology)No
Configurable TDP-up65 W
Packaging data
Package typeBox
Logistics data
Harmonized System (HS) code85423119
Processor family
Intel Core i3
Intel Xeon Silver
Intel Xeon Silver
AMD Ryzen 3
AMD Ryzen 3
AMD Ryzen 7
On-board graphics card
N
N
N
Y
Y
Y
Discrete graphics card
N
N
N
N
N
N
Processor lithography
N/A
up to 22nm
up to 22nm
up to 22nm
up to 22nm
up to 22nm
Processor cores
4
8
8
4
4
8
Processor socket
LGA 1700
LGA 3647 (Socket P)
LGA 3647 (Socket P)
Socket AM4
Socket AM4
Socket AM4
Cooler included
Y
N/A
N
Y
N
Y
Package type
Box
N/A
N/A
Box
Tray
Box